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STRUCTURE CHANGES IN GaAs CHIPS DEFORMED BY PRESSING AT 300 K
Author(s) -
Denys Moskal,
V. Nadtochiy,
N. N. Golodenko
Publication year - 2014
Publication title -
sensorna elektronìka ì mìkrosistemnì tehnologìï
Language(s) - English
Resource type - Journals
eISSN - 2415-3508
pISSN - 1815-7459
DOI - 10.18524/1815-7459.2004.2.111963
Subject(s) - pressing , materials science , cleavage (geology) , etching (microfabrication) , crystallography , isotropic etching , composite material , stress (linguistics) , chip , chemistry , layer (electronics) , electrical engineering , engineering , linguistics , philosophy , fracture (geology)

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