Open AccessRESEARCH OF A STRESS-STRAIN STATE OF POLYIMIDIC INTERCONNECTION STRUCTURES ON FLEXIBLE PRINTED CIRCUIT BOARD
Author(s) -
Ігор Невлюдов,
Віктор Андрійович Палагін,
Наталія Павлівна Демська,
Вікторія Валеріївна Невлюдова,
М. Г. Стародубцев
Publication year - 2019
Publication title -
problemy treniâ i iznašivaniâ
Language(s) - English
Resource type - Journals
ISSN - 0370-2197
DOI - 10.18372/0370-2197.2(83).13693
Subject(s) - printed circuit board , durability , interconnection , stress (linguistics) , cable gland , structural engineering , bending , microelectronics , mechanical engineering , electrical conductor , materials science , composite material , computer science , engineering , electrical engineering , telecommunications , linguistics , philosophy