Open AccessDie separation strength for deep reactive ion etched wafers.
Author(s) -
Daniel Porter
Publication year - 2010
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.18297/etd/1144
Subject(s) - deep reactive ion etching , wafer dicing , die (integrated circuit) , materials science , wafer , etching (microfabrication) , microfabrication , bending , composite material , substrate (aquarium) , silicon , grinding , reactive ion etching , optoelectronics , nanotechnology , layer (electronics) , fabrication , medicine , oceanography , alternative medicine , pathology , geology
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