Open AccessEXPERIMENTAL TECHNIQUE FOR DETERMINING THE EVOLUTION OF THE BENDING SHAPE OF THIN SUBSTRATE BY THE COPPER ELECTROCRYSTALLIZATION IN AREAS OF COMPLEX SHAPES
Author(s) -
Pavel S. Bychkov,
С. А. Лычев,
Д К Бут
Publication year - 2019
Publication title -
vestnik samarskogo universiteta. estestvennonaučnaâ seriâ
Language(s) - English
Resource type - Journals
eISSN - 2712-8954
pISSN - 2541-7525
DOI - 10.18287/2541-7525-2019-25-4-48-73
Subject(s) - deflection (physics) , thin film , copper , materials science , bending , layer (electronics) , boundary value problem , thin layer , electrochemistry , substrate (aquarium) , geometry , composite material , optics , metallurgy , chemistry , mathematics , mathematical analysis , nanotechnology , geology , physics , electrode , oceanography
The present paper is aimed of experimental technique of local incompatible deformations identificationin thin layers obtained as a result of electrocrystallization. The process of electrocrystallization is carried on thin substrates. Changes in time of form of these thin substrates are registered during the experiment. Identification of local incompatible deformations parameters is carried out from the condition of the minimum deflection of experimentally detected displacements and displacements that were determined by theoretical relations. As such a relationship the solution of a boundary value problem for a layer by layer growing plate is used in the paper. Significant difference of suggested technique from known methods is that testing electrocrystallization is carried out in areas of various forms. It allows to provide analysis of the influence that corner points of deposition areas boundary have on incompatible deformations caused by electrochemical process.