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Thermal performance investigation of position function circuit board used in automotive exterior rear lighting
Author(s) -
Birhat SÖNMEZAY,
Mehmet Aktaş
Publication year - 2022
Publication title -
international journal of automotive engineering and technologies
Language(s) - English
Resource type - Journals
ISSN - 2146-9067
DOI - 10.18245/ijaet.830838
Subject(s) - printed circuit board , computational fluid dynamics , light emitting diode , junction temperature , automotive industry , thermal , led lamp , chip , natural convection , heat generation , mechanical engineering , materials science , convection , electronic engineering , mechanics , engineering , optoelectronics , electrical engineering , aerospace engineering , physics , meteorology , thermodynamics

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