Open AccessVerification Platform of 40Gbps High-speed Serial Interface Chip Based on UVM
Publication year - 2017
Publication title -
proceedings of 2017 the 7th international workshop on computer science and engineering
Language(s) - English
Resource type - Conference proceedings
DOI - 10.18178/wcse.2017.06.071
Subject(s) - computer science , chip , embedded system , interface (matter) , system on a chip , computer hardware , operating system , telecommunications , bubble , maximum bubble pressure method