Open AccessVerification Platform of 40Gbps High-speed Serial Interface Chip Based on UVM
Publication year - 2017
Publication title -
proceedings of 2016 the 6th international workshop on computer science and engineering
Language(s) - English
Resource type - Conference proceedings
DOI - 10.18178/wcse.2017.06.071
Subject(s) - computer science , chip , embedded system , interface (matter) , system on a chip , computer hardware , operating system , telecommunications , bubble , maximum bubble pressure method
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