Open AccessMachining millimeter-scale deep holes in SiCf/SiC material using femtosecond laser filamentation effect
Author(s) -
Jie Zhao,
Wenjun Wang,
Ruijia Wang,
Jianlei Cui
Publication year - 2018
Publication title -
materials science. advanced composite materials
Language(s) - English
Resource type - Journals
ISSN - 2529-7783
DOI - 10.18063/msacm.v2i1.748
Subject(s) - materials science , femtosecond , filamentation , laser , millimeter , optics , laser ablation , scanning electron microscope , machining , saturation (graph theory) , laser power scaling , composite material , metallurgy , physics , mathematics , combinatorics
A 3.5 mm thick SiCf/SiC material was drilled in air environment using a femtosecond laser filament effect. The surface morphology of deep micropores was observed by scanning electron microscopy and the depth and profile of the pores were observed using μm-CT. The variation of entrance diameter, exit diameter and depth variation with laser focus position and processing time was further analyzed. The results showed that as the processing time of femtosecond laser increases, the ablation threshold of the material reached saturation. The exit and entrance diameter also stopped increasing and the aperture tend to saturate. The focus entered the interior of the material, allowing the location of the peak power near the surface of the material. So the entrance aperture was of good quality and the exit aperture was round.