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APPLICATION OF DATA GLOVE FOR ASSEMBLY ANALYSIS OF SELECTED COMPONENT
Author(s) -
Naqib Daneshjo,
Albert Mareš,
Erika Dudáš Pajerská,
Enayat Danishjoo
Publication year - 2019
Publication title -
mm science journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.195
H-Index - 10
eISSN - 1805-0476
pISSN - 1803-1269
DOI - 10.17973/mmsj.2019_10_2019039
Subject(s) - component (thermodynamics) , wired glove , computer science , operating system , physics , virtual reality , thermodynamics

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