
Fatigue Crack Growth Properties of Epoxy Adhesives under Mode Ⅱ Loading
Author(s) -
박성완
Publication year - 2014
Publication title -
han'gug gi'gye gi'sul haghoeji/han-guk gigye gisul hakoeji
Language(s) - English
Resource type - Journals
eISSN - 2092-0385
pISSN - 1229-604X
DOI - 10.17958/ksmt.16.1.201402.1055
Subject(s) - epoxy , materials science , adhesive , composite material , mode (computer interface) , paris' law , epoxy adhesive , structural engineering , crack closure , fracture mechanics , computer science , engineering , layer (electronics) , operating system