Open AccessHigh process yield rates of thermoplastic nanofluidic devices using a hybrid thermal assembly technique
Author(s) -
Franklin I. Uba,
Bo Hu,
Kumuditha M. Weerakoon-Ratnayake,
Nyoté J. Oliver-Calixte,
Steven A. Soper
Publication year - 2015
Publication title -
carolina digital repository (university of north carolina at chapel hill)
Language(s) - English
DOI - 10.17615/wxp1-rn52
Subject(s) - yield (engineering) , thermoplastic , materials science , process (computing) , thermal , nanotechnology , process engineering , composite material , computer science , engineering , thermodynamics , physics , operating system