Open AccessDetermination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review
Author(s) -
Shantanu Patil,
Govind Waghmare
Publication year - 2015
Publication title -
international journal of engineering research and
Language(s) - English
Resource type - Journals
ISSN - 2278-0181
DOI - 10.17577/ijertv4is040112
Subject(s) - finite element method , chip , semiconductor , materials science , structural engineering , electronic engineering , mechanical engineering , engineering , electrical engineering , optoelectronics
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