Open AccessNumerical Modelling of Cyclic Stress-Strain Behaviour of Sn Pb Solder Joint During Thermal Fatigue
Author(s) -
Mohd Nasir Tamin,
Yek Ban Liew
Publication year - 2008
Publication title -
jurnal kejuruteraan
Language(s) - English
Resource type - Journals
eISSN - 2289-7526
pISSN - 0128-0198
DOI - 10.17576/jkukm-2008-20-09
Subject(s) - soldering , materials science , joint (building) , thermal fatigue , strain (injury) , stress–strain curve , cyclic stress , stress (linguistics) , thermal , composite material , structural engineering , metallurgy , engineering , deformation (meteorology) , medicine , thermodynamics , physical therapy , physics , linguistics , philosophy