Stochastic modelling of the temperature increase in metal stampings with multiple stress variables and random effects for reliability assessment | Zendy

Andrea Quezada del Villar | Zendy; Luis Alberto RodríguezPicón | Zendy; Iván Juan Carlos Pérez-Olguín | Zendy; Luis Carlos MéndezGonzález | Zendy

Open Access

Stochastic modelling of the temperature increase in metal stampings with multiple stress variables and random effects for reliability assessment

Author(s) -

Andrea Quezada del Villar,

Luis Alberto RodríguezPicón,

Iván Juan Carlos Pérez-Olguín,

Luis Carlos MéndezGonzález

Publication year - 2019

Publication title -

eksploatacja i niezawodnosc - maintenance and reliability

Language(s) - English

Resource type - Journals

eISSN - 2956-3860

pISSN - 1507-2711

DOI - 10.17531/ein.2019.4.15

Subject(s) - unobservable , reliability (semiconductor) , random variable , gamma process , random effects model , reliability engineering , computer science , bayesian probability , statistical inference , degradation (telecommunications) , bayesian inference , accelerated life testing , econometrics , statistics , mathematics , engineering , weibull distribution , artificial intelligence , power (physics) , medicine , telecommunications , physics , meta analysis , quantum mechanics

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