Open AccessStochastic modelling of the temperature increase in metal stampings with multiple stress variables and random effects for reliability assessment
Author(s) -
Andrea Viridiana Quezada del Villar,
Luis Alberto RodríguezPicón,
Iván Juan Carlos Pérez-Olguín,
Luis Carlos MéndezGonzález
Publication year - 2019
Publication title -
eksploatacja i niezawodność
Language(s) - English
Resource type - Journals
eISSN - 2956-3860
pISSN - 1507-2711
DOI - 10.17531/ein.2019.4.15
Subject(s) - unobservable , reliability (semiconductor) , random variable , gamma process , random effects model , reliability engineering , computer science , bayesian probability , statistical inference , degradation (telecommunications) , bayesian inference , accelerated life testing , econometrics , statistics , mathematics , engineering , weibull distribution , artificial intelligence , power (physics) , medicine , telecommunications , physics , meta analysis , quantum mechanics