
On the Suitability of Phase Change Material (PCM) for Thermal Management of Electronic Components
Author(s) -
Thota Markandeyulu,
Jaya Krishna Devanuri,
K. Kiran Kumar
Publication year - 2016
Publication title -
indian journal of science and technology
Language(s) - English
Resource type - Journals
eISSN - 0974-6846
pISSN - 0974-5645
DOI - 10.17485/ijst/2016/v9is1/107939
Subject(s) - electronics , electronic component , heat sink , thermal management of electronic devices and systems , phase change material , computer science , safer , electronic packaging , heat transfer , passive cooling , thermal , mechanical engineering , process engineering , phase change , electrical engineering , engineering physics , engineering , physics , thermodynamics , computer security , meteorology