Open AccessPerformance Analysis of Single-Wall Carbon Nanotubes and Copper as VLSI Interconnect
Author(s) -
Guriqbal Singh Dhillon,
N. Raghu
Publication year - 2016
Publication title -
indian journal of science and technology
Language(s) - English
Resource type - Journals
eISSN - 0974-6846
pISSN - 0974-5645
DOI - 10.17485/ijst/2016/v9is1/106892
Subject(s) - copper interconnect , very large scale integration , bundle , electromigration , materials science , interconnection , carbon nanotube , rlc circuit , node (physics) , copper , mean free path , nanotechnology , optoelectronics , electronic engineering , scattering , computer science , composite material , electrical engineering , voltage , telecommunications , physics , engineering , acoustics , capacitor , optics , metallurgy