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Stressed State of the Surface Layer of VT6 Titanium Alloy after Copper and Lead Ion Implantation
Author(s) -
Н. В. Учеваткина,
Yu. M. Borovin,
В. В. Овчинников,
O. A. Zhdanovich,
A. G. Sbitnev
Publication year - 2015
Publication title -
indian journal of science and technology
Language(s) - English
Resource type - Journals
eISSN - 0974-6846
pISSN - 0974-5645
DOI - 10.17485/ijst/2015/v8i36/90543
Subject(s) - materials science , ion implantation , surface layer , alloy , dislocation , microstructure , copper , annealing (glass) , residual stress , metallurgy , titanium , tin , composite material , layer (electronics) , ion , chemistry , organic chemistry

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