Open AccessMass-Transfer Characteristics of the Regular Packing Device with the Integrated Heat-Transfer Modules
Author(s) -
A. V. Stepykin,
A. A. Sidyagin,
V. M. Ulyanov
Publication year - 2015
Publication title -
vestnik tambovskogo gosudarstvennogo tehničeskogo universiteta
Language(s) - English
Resource type - Journals
eISSN - 2542-1409
pISSN - 0136-5835
DOI - 10.17277/vestnik.2015.03.pp.445-452
Subject(s) - transfer (computing) , mass transfer , heat transfer , materials science , computer science , mechanics , parallel computing , physics