Open AccessStudy on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates
Author(s) -
Shang-Wu Tsai,
Shih-Kai Chien,
Kun-Tso Chen,
Tsung-Ying Tsai,
Wen-Cheng Tseng
Publication year - 2021
Publication title -
journal of mechanics engineering and automation
Language(s) - English
Resource type - Journals
eISSN - 2159-5283
pISSN - 2159-5275
DOI - 10.17265/2159-5275/2021.05.002
Subject(s) - stacking , bead , welding , copper , materials science , aluminium , bonding strength , electrode , metallurgy , laser , composite material , chemistry , optics , physics , organic chemistry