Open AccessEffect of the electromagnetic compound field on the grain growth and wear resistance of a Cu-Pb monotectic alloy
Author(s) -
Z. Li,
Tianbo Yu,
D. Wang,
Gui-Li Geng
Publication year - 2020
Publication title -
materiali in tehnologije
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.27
H-Index - 25
eISSN - 1580-3414
pISSN - 1580-2949
DOI - 10.17222/mit.2019.115
Subject(s) - materials science , alloy , metallurgy , wear resistance , field (mathematics) , mathematics , pure mathematics
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