Open AccessCellular automata simulation of the dynamic recrystallization of the TC4 alloy during hot compression
Author(s) -
Han Fu,
Y. Wang,
R. Chen,
Qingfei Gao,
Y. Wang
Publication year - 2019
Publication title -
materiali in tehnologije
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.27
H-Index - 25
eISSN - 1580-3414
pISSN - 1580-2949
DOI - 10.17222/mit.2018.273
Subject(s) - materials science , dynamic recrystallization , alloy , recrystallization (geology) , cellular automaton , compression (physics) , metallurgy , hot working , composite material , computer science , artificial intelligence , paleontology , biology