Copper nanoparticles as nanofillers in an adhesive resin system: An in vitro study | Zendy

Rafael TorresRosas | Zendy; Nayely Torres-Gómez | Zendy; René GarcíaContreras | Zendy; Rogelio José ScougallVilchis | Zendy; Luis Roberto Domínguez-Díaz | Zendy; Liliana ArguetaFigueroa | Zendy

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Copper nanoparticles as nanofillers in an adhesive resin system: An in vitro study

Author(s) -

Rafael TorresRosas,

Nayely Torres-Gómez,

René GarcíaContreras,

Rogelio José ScougallVilchis,

Luis Roberto Domínguez-Díaz,

Liliana ArguetaFigueroa

Publication year - 2020

Publication title -

dental and medical problems

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.249

H-Index - 8

eISSN - 2300-9020

pISSN - 1644-387X

DOI - 10.17219/dmp/121973

Subject(s) - adhesive , antibacterial activity , streptococcus mutans , nuclear chemistry , chlorhexidine , nanoparticle , antimicrobial , chemistry , copper , staphylococcus aureus , agar diffusion test , agar , materials science , composite material , dentistry , bacteria , nanotechnology , organic chemistry , layer (electronics) , medicine , biology , genetics

The incorporation of an antibacterial agent into an adhesive could improve its clinical performance. Some nanoparticles (NPs), including copper nanoparticles (Cu NPs), display an antibacterial effect. Therefore, Cu NPs could act as a nanofiller when added to an adhesive.

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