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Copper nanoparticles as nanofillers in an adhesive resin system: An in vitro study
Author(s) -
Rafael TorresRosas,
Nayely Torres-Gómez,
René García-Contreras,
Rogelio José Scougall Vilchis,
Luis Roberto Domínguez-Díaz,
Liliana Argueta-Figueroa
Publication year - 2020
Publication title -
dental and medical problems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.249
H-Index - 8
eISSN - 2300-9020
pISSN - 1644-387X
DOI - 10.17219/dmp/121973
Subject(s) - adhesive , copper , nanoparticle , in vitro , materials science , composite material , chemistry , nanotechnology , metallurgy , layer (electronics) , biochemistry
The incorporation of an antibacterial agent into an adhesive could improve its clinical performance. Some nanoparticles (NPs), including copper nanoparticles (Cu NPs), display an antibacterial effect. Therefore, Cu NPs could act as a nanofiller when added to an adhesive.

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