
SEALING OF ELECTRONIC MODULE PACKAGES
Author(s) -
Natalia A. Astafeva,
Е. П. Николаева
Publication year - 2018
Publication title -
učenye zapiski komsomolʹskogo-na-amure gosudarstvennogo tehničeskogo universiteta
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2222-5218
pISSN - 2076-4359
DOI - 10.17084/iii-1(34).10
Subject(s) - computer science , materials science