Open AccessProcesses During Annealing of Ti—Al—Ni and Ti—Al—Ni—Au Contact Metallization Systems
Author(s) -
К. Д. Ванюхин,
Р. В. Захарченко,
Н. Каргин,
Mikhail V. Pashkov,
Л. А. Сейдман
Publication year - 2015
Publication title -
izvestiâ vysših učebnyh zavedenij. materialy èlektronnoj tehniki
Language(s) - English
Resource type - Journals
eISSN - 2413-6387
pISSN - 1609-3577
DOI - 10.17073/1609-3577-2014-2-122-127
Subject(s) - materials science , intermetallic , annealing (glass) , hillock , surface roughness , metallurgy , surface finish , titanium , alloy , electrical resistivity and conductivity , metallizing , aluminium , nanocrystalline material , composite material , metal , nanotechnology , electrical engineering , engineering