Open AccessHydrogen–Induced Cleavage of Silicon Wafers by Electrochemical Etching
Author(s) -
К. Н. Тыныштыкбаев,
Ю. А. Рябикин,
С. Ж. Токмолдин,
Б. А. Рахметов,
Т. Айтмукан
Publication year - 2015
Publication title -
izvestiâ vysših učebnyh zavedenij. materialy èlektronnoj tehniki
Language(s) - English
Resource type - Journals
eISSN - 2413-6387
pISSN - 1609-3577
DOI - 10.17073/1609-3577-2012-4-40-44
Subject(s) - wafer , cleavage (geology) , etching (microfabrication) , silicon , materials science , electrochemistry , hydrogen , optoelectronics , nanotechnology , chemistry , composite material , electrode , organic chemistry , layer (electronics) , fracture (geology)