Open AccessImproved Predictive Modeling Techniques for Non-Linear Solder Material Behavior
Author(s) -
Arman Ahari
Publication year - 2021
Language(s) - Uncategorized
Resource type - Dissertations/theses
DOI - 10.15760/etd.7667
Subject(s) - soldering , viscoplasticity , reliability (semiconductor) , electronic packaging , materials science , integrated circuit packaging , visibility , mechanical engineering , reliability engineering , computer science , electronic engineering , structural engineering , engineering , finite element method , composite material , integrated circuit , constitutive equation , optoelectronics , optics , power (physics) , physics , quantum mechanics
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