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Modal Analysis of an Adhesive Joint
Author(s) -
Kedar V Desai Aniket D Kadam
Publication year - 2015
Publication title -
international journal of innovative research in science engineering and technology
Language(s) - English
Resource type - Journals
eISSN - 2347-6710
pISSN - 2319-8753
DOI - 10.15680/ijirset.2015.0406045
Subject(s) - adhesive , modal , joint (building) , structural engineering , modal analysis , computer science , engineering , materials science , finite element method , composite material , layer (electronics)

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