Open AccessMeasure of Heat Conduction through Copper
Author(s) -
Er. Pal Riya Bipr adas Sanchita
Publication year - 2015
Publication title -
international journal of advanced research in electrical, electronics and instrumentation engineering
Language(s) - English
Resource type - Journals
eISSN - 2320-3765
pISSN - 2278-8875
DOI - 10.15662/ijareeie.2015.0406021
Subject(s) - measure (data warehouse) , copper , thermal conduction , materials science , metallurgy , composite material , computer science , data mining