z-logo
open-access-imgOpen Access
ANALYSIS OF ELECTRICAL AND THERMAL CHARACTERISTICS OF LOAD-RELAY CIRCUIT USING THERMAL IMAGING
Author(s) -
Akshay Anil Sarawade .
Publication year - 2018
Publication title -
international journal of research in engineering and technology
Language(s) - English
Resource type - Journals
eISSN - 2321-7308
pISSN - 2319-1163
DOI - 10.15623/ijret.2018.0712006
Subject(s) - relay , thermal , electrical engineering , materials science , engineering , physics , meteorology , power (physics) , quantum mechanics

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here