Open AccessFATIGUE LIFE PREDICTION FOR SOLDER INTERCONNECTS IN IGBT MODULES BY USING SUCCESSIVE INITIATION METHOD
Author(s) -
Dipesh Kumbhakarna
Publication year - 2016
Publication title -
international journal of research in engineering and technology
Language(s) - English
Resource type - Journals
eISSN - 2321-7308
pISSN - 2319-1163
DOI - 10.15623/ijret.2016.0504052
Subject(s) - insulated gate bipolar transistor , soldering , materials science , reliability engineering , forensic engineering , electronic engineering , composite material , electrical engineering , engineering , voltage