Open AccessEffect and Mechanism of the Surface Treatment and Gradation Filling of AlN on the Performance of Insulation Layer of Copper Clad Laminate
Author(s) -
Weiwei Zhang,
Chen Lǚ,
Guobing Ying,
Jianfeng Zhang,
Wan Jiang
Publication year - 2021
Publication title -
journal of inorganic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.252
H-Index - 25
ISSN - 1000-324X
DOI - 10.15541/jim20200639
Subject(s) - gradation , materials science , composite material , copper , layer (electronics) , mechanism (biology) , metallurgy , philosophy , epistemology , computer science , computer vision
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