Open AccessMicrostructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior
Author(s) -
Dan Cheng,
Bin Huang,
Tao Chen,
JING Feng-Juan,
Xie Dong,
Y.X. Leng,
Nan Huang
Publication year - 2018
Publication title -
journal of inorganic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.252
H-Index - 25
ISSN - 1000-324X
DOI - 10.15541/jim20180004
Subject(s) - materials science , microstructure , copper , ion , chemical engineering , composite material , metallurgy , nanotechnology , organic chemistry , chemistry , engineering
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