Open AccessEffect of Plating Solution Flow Pattern on Preparation of Electroless Copper- Plated Carbon Foam under Vacuum and Ultrasonic Condition
Author(s) -
Yang Liu,
Xiujun Liu,
Tongqi Li,
Han Ruilian,
FENG Zhi-Hai
Publication year - 2015
Publication title -
journal of inorganic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.252
H-Index - 25
ISSN - 1000-324X
DOI - 10.15541/jim20150276
Subject(s) - materials science , copper , electroless plating , ultrasonic sensor , plating (geology) , copper plating , metallurgy , carbon nanofoam , flow (mathematics) , composite material , layer (electronics) , acoustics , porosity , electroplating , physics , geophysics , geology , geometry , mathematics
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