Open AccessEffect of Plating Solution Flow Pattern on Preparation of Electroless Copper- Plated Carbon Foam under Vacuum and Ultrasonic Condition
Author(s) -
Liu Yang,
Xiujun Liu,
Tongqi Li,
Ru Han,
Zhen Feng
Publication year - 2016
Publication title -
wuji cailiao xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.252
H-Index - 25
ISSN - 1000-324X
DOI - 10.15541/jim20150276
Subject(s) - materials science , copper , electroless plating , ultrasonic sensor , plating (geology) , copper plating , metallurgy , carbon nanofoam , flow (mathematics) , composite material , layer (electronics) , acoustics , porosity , electroplating , physics , geophysics , geology , geometry , mathematics