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Interface Structure and Electrical Property of Yb$lt;inf$gt;0.3$lt;/inf$gt;Co$lt;inf$gt;4$lt;/inf$gt;Sb$lt;inf$gt;12$lt;/inf$gt;/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder
Author(s) -
TANG Yun-Shan,
BAI Sheng-Qiang,
REN Du-Di,
LIAO Jin-Cheng,
Lanting Zhang,
Lidong Chen
Publication year - 2015
Publication title -
journal of inorganic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.252
H-Index - 25
ISSN - 1000-324X
DOI - 10.15541/jim20140378
Subject(s) - materials science

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