Open AccessGalvanic interconnects for thermoelectric cooling modules
Author(s) -
M. M. Krechun
Publication year - 2019
Publication title -
fìzika ì hìmìâ tverdogo tìla
Language(s) - English
Resource type - Journals
eISSN - 2309-8589
pISSN - 1729-4428
DOI - 10.15330/pcss.20.1.88
Subject(s) - bismuth telluride , galvanic cell , thermoelectric effect , materials science , electroplating , thermoelectric cooling , bismuth , thermoelectric materials , metallurgy , nanotechnology , composite material , thermodynamics , thermal conductivity , physics , layer (electronics)
The paper studies the use of galvanic technologies in thermoelectricity. The technological features of applying anti-diffusion coatings on bismuth telluride based thermoelectric material (TEM) by electroplating method are considered. The advantages and disadvantages of the properties of anti-diffusion structures obtained by the electrochemical method are determined.