Galvanic interconnects for thermoelectric cooling modules | Zendy

M.M. Krechun | Zendy

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Galvanic interconnects for thermoelectric cooling modules

Author(s) -

M.M. Krechun

Publication year - 2019

Publication title -

physics and chemistry of solid state

Language(s) - English

Resource type - Journals

eISSN - 2309-8589

pISSN - 1729-4428

DOI - 10.15330/pcss.20.1.88

Subject(s) - bismuth telluride , galvanic cell , thermoelectric effect , materials science , electroplating , thermoelectric cooling , bismuth , thermoelectric materials , metallurgy , nanotechnology , composite material , thermodynamics , thermal conductivity , physics , layer (electronics)

The paper studies the use of galvanic technologies in thermoelectricity. The technological features of applying anti-diffusion coatings on bismuth telluride based thermoelectric material (TEM) by electroplating method are considered. The advantages and disadvantages of the properties of anti-diffusion structures obtained by the electrochemical method are determined.

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