Open AccessIsothermal section of the Ho–Cu–Sn ternary system at 670 K
Author(s) -
L. Romaka,
I. Romaniv,
V.V. Romaka,
M. Konyk,
A. Horyń,
Yuriy Stadnyk
Publication year - 2019
Publication title -
fìzika ì hìmìâ tverdogo tìla
Language(s) - English
Resource type - Journals
eISSN - 2309-8589
pISSN - 1729-4428
DOI - 10.15330/pcss.19.2.139-146
Subject(s) - ternary operation , group (periodic table) , isothermal process , ternary numeral system , crystallography , type (biology) , chemistry , space (punctuation) , powder diffraction , materials science , physics , thermodynamics , ecology , linguistics , philosophy , organic chemistry , biology , computer science , programming language
The interaction of the components in the Ho-Cu-Sn ternary system was investigated at 670 K over the whole concentration range using X-ray diffraction and EPM analyses. Four ternary compounds were formed in the Ho–Cu–Sn system at 670 K: HoCuSn (LiGaGe type, space group P63mc), Ho3Cu4Sn4 (Gd3Cu4Ge4-type, space group Immm), HoCu5Sn (CeCu5Au-type, space group Pnma), and Ho1.9Cu9.2Sn2.8 (Dy1.9Cu9.2Sn2.8-type, space group P63/mmc). The formation of the interstitial solid solution based on HoSn2 (ZrSi2-type) binary compound up to 5 at. % Cu was found.