Isothermal section of the Ho–Cu–Sn ternary system at 670 K | Zendy

L. Romaka | Zendy; I. Romaniv | Zendy; V.V. Romaka | Zendy; M. Konyk | Zendy; А. Horyn | Zendy; Yu. Stadnyk | Zendy

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Isothermal section of the Ho–Cu–Sn ternary system at 670 K

Author(s) -

L. Romaka,

I. Romaniv,

V.V. Romaka,

M. Konyk,

А. Horyn,

Yu. Stadnyk

Publication year - 2018

Publication title -

physics and chemistry of solid state

Language(s) - English

Resource type - Journals

eISSN - 2309-8589

pISSN - 1729-4428

DOI - 10.15330/pcss.19.2.139-146

Subject(s) - ternary operation , group (periodic table) , isothermal process , ternary numeral system , crystallography , type (biology) , chemistry , space (punctuation) , powder diffraction , materials science , physics , thermodynamics , ecology , linguistics , philosophy , organic chemistry , biology , computer science , programming language

The interaction of the components in the Ho-Cu-Sn ternary system was investigated at 670 K over the whole concentration range using X-ray diffraction and EPM analyses. Four ternary compounds were formed in the Ho–Cu–Sn system at 670 K: HoCuSn (LiGaGe type, space group P63mc), Ho3Cu4Sn4 (Gd3Cu4Ge4-type, space group Immm), HoCu5Sn (CeCu5Au-type, space group Pnma), and Ho1.9Cu9.2Sn2.8 (Dy1.9Cu9.2Sn2.8-type, space group P63/mmc). The formation of the interstitial solid solution based on HoSn2 (ZrSi2-type) binary compound up to 5 at. % Cu was found.

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