Open AccessAn overview of high thermal conductive hot press forming die material development
Author(s) -
Abd Rahman Zulhishamuddin,
S. N. Aqida
Publication year - 2015
Publication title -
journal of mechanical engineering and sciences
Language(s) - English
Resource type - Journals
eISSN - 2231-8380
pISSN - 2289-4659
DOI - 10.15282/jmes.9.2015.14.0162
Subject(s) - die (integrated circuit) , materials science , engineering physics , engineering , nanotechnology