Open AccessA Pipe Heat Insulation Device Featuring Vacuum Valve Box Structure
Author(s) -
Cheng-cheng Shao
Publication year - 2014
Publication title -
archives of design research/di'jainhag yeon'gu
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.179
H-Index - 4
eISSN - 2288-2987
pISSN - 1226-8046
DOI - 10.15187/adr.2014.11.112.4.31
Subject(s) - mechanical engineering , heat pipe , vacuum insulated panel , engineering drawing , thermal insulation , materials science , engineering , electrical engineering , composite material , heat transfer , physics , mechanics , layer (electronics)