
Enhancing the Mechanical Properties of Z-Spring by Implementing CF&GF Hybrid Prepreg Lamination Patterns
Author(s) -
Jeong-Keun Kim,
SunHo Choi,
Young-Keun Kim,
Hong-Gun Kim,
Lee-Ku Kwac
Publication year - 2021
Publication title -
han'gug gi'gye ga'gong haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2021.20.03.053
Subject(s) - lamination , spring (device) , materials science , composite material , structural engineering , engineering , layer (electronics)