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Effects of Insert Materials of Retaining Ring on Polishing Finish in Oxide CMP
Author(s) -
Ki-Won Park,
Dong Sam Park
Publication year - 2019
Publication title -
journal of the korean society of manufacturing process engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2019.18.8.044
Subject(s) - polishing , insert (composites) , materials science , chemical mechanical planarization , ring (chemistry) , oxide , metallurgy , composite material , chemistry , organic chemistry

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