Open AccessFabrication of Multilayered Structures in Electrochemical Etching using a Copper Protective Layer
Author(s) -
Hong-Shik Shin
Publication year - 2019
Publication title -
journal of the korean society of manufacturing process engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2019.18.2.038
Subject(s) - fabrication , etching (microfabrication) , layer (electronics) , materials science , copper , electrochemistry , composite material , metallurgy , nanotechnology , chemistry , electrode , medicine , alternative medicine , pathology
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