Open AccessFabrication of Multilayered Structures in Electrochemical Etching using a Copper Protective Layer
Author(s) -
Hong-Shik Shin
Publication year - 2019
Publication title -
han'gug gi'gye ga'gong haghoeji/han-guk gigye gagong hakoeji
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2019.18.2.038
Subject(s) - fabrication , etching (microfabrication) , layer (electronics) , materials science , copper , electrochemistry , composite material , metallurgy , nanotechnology , chemistry , electrode , medicine , alternative medicine , pathology