Open AccessEffects of Temperature on Removal Rate in Cu CMP
Author(s) -
In-Ho Park,
Dasol Lee,
Seonho Jeong,
Haedo Jeong
Publication year - 2018
Publication title -
han'gug gi'gye ga'gong haghoeji/han-guk gigye gagong hakoeji
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2018.17.6.091
Subject(s) - chemical mechanical planarization , slurry , abrasion (mechanical) , materials science , planarity testing , composite material , polishing , chemistry , crystallography