Open AccessPerformance Evaluation of Dicing Sawing of High-densified Al2O3 Bulk using Diamond Electroplated Band-saw Machine
Author(s) -
Young Moo Lee,
Young-Chan Park,
Dong-Hyun Kim,
Man-Young Lee,
Myung Chang Kang
Publication year - 2017
Publication title -
han'gug gi'gye ga'gong haghoeji/han-guk gigye gagong hakoeji
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2017.16.6.001
Subject(s) - wafer dicing , diamond , electroplating , materials science , metallurgy , composite material , layer (electronics)