Open AccessStudy on Thermal Analysis for Heating System of Mobile Smart Device Cover Glass Molding Machine
Author(s) -
Hwan June Shin,
Jun Kyoung Lee
Publication year - 2014
Publication title -
journal of the korean society of manufacturing process engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-0771
pISSN - 1598-6721
DOI - 10.14775/ksmpe.2014.13.4.050
Subject(s) - molding (decorative) , materials science , cover (algebra) , thermal , mechanical engineering , mold , composite material , engineering , physics , meteorology
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