
Punch Force Behavior during Micro V-Bending Process of the Copper Foil
Author(s) -
Gandjar Kiswanto,
Aida Mahmudah,
Dedi Priadi
Publication year - 2017
Publication title -
international journal of technology
Language(s) - English
Resource type - Journals
ISSN - 2087-2100
DOI - 10.14716/ijtech.v8i7.747
Subject(s) - foil method , copper , materials science , bending , composite material , process (computing) , metallurgy , computer science , operating system