Open AccessThermal analysis of metal-ceramic bonding using finite element method
Author(s) -
Smitha Gopinath,
R. Sabarish,
R. Sasidharan
Publication year - 2014
Publication title -
international journal of engineering and technology
Language(s) - English
Resource type - Journals
ISSN - 2227-524X
DOI - 10.14419/ijet.v3i2.1830
Subject(s) - thermal expansion , materials science , ceramic , finite element method , composite material , bonding strength , stress (linguistics) , metal , thermal , interface (matter) , structural engineering , metallurgy , thermodynamics , linguistics , philosophy , physics , capillary number , capillary action , engineering
This paper reports a finite element study of effect of bonding strength between metal and ceramic. The bonding strength is evaluated with different processing temperature and holding time. The difference between the coefficients of linear thermal expansion (CTEs) of the metal and ceramic induces thermal stress at the interface. The mismatch thermal stress at the interface region plays an important role in improving bonding strength. Hence, it is essential to evaluate the interface bonding in metal-ceramics joints. The Al/SiC bonding was modeled and analyzed using finite element analysis in ANSYS (v.10). Keywords: Bonding Strength, Coefficient of Thermal Expansion, Thermal Stress, Interface, Al/Sic, FEA.