Open AccessEvaluation of the Impact Shear Strength of Thermal Aged Lead-Free Solder Ball Joints
Author(s) -
Chin Sung Chung,
Ho Kyung Kim
Publication year - 2015
Publication title -
journal of the korean society of safety
Language(s) - English
Resource type - Journals
eISSN - 2383-9953
pISSN - 1738-3803
DOI - 10.14346/jkosos.2015.30.6.7
Subject(s) - soldering , materials science , composite material , joint (building) , shear strength (soil) , toughness , metallurgy , shear (geology) , copper , shear stress , structural engineering , environmental science , soil science , engineering , soil water
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