Open AccessInfluence of Copper Vapors in SF6 Plasma
Author(s) -
Pierre Freton,
JeanJacques Gonzalez,
A. Harry Solo,
F. Reichert,
A. Petchanka
Publication year - 2019
Publication title -
plasma physics and technology
Language(s) - English
Resource type - Journals
eISSN - 2336-2634
pISSN - 2336-2626
DOI - 10.14311/ppt.2019.2.161
Subject(s) - copper , plasma , vapours , anode , electrode , atmospheric pressure plasma , analytical chemistry (journal) , current (fluid) , flux (metallurgy) , chemistry , atomic physics , diffusion , materials science , thermodynamics , metallurgy , physics , chromatography , quantum mechanics , neuroscience , biology
In this study a theoretical approach allows estimating the ablation mass flux of copper from a corrected Hertz-Knudsen flux. The influence of the copper vapours coming from the anode electrode to an SF 6 plasma is studied in a simplified 2D configuration. Depending on the plasma pressure an ablation or a diffusion state is considered. The amount of copper versus time is presented. An RMS current I=10 kA is applied leading at t=10 ms to an amount of copper equal to 0.55 mg. The vapours change the plasma properties mainly the electrical conductivity and radiation and so the plasma behaviour. At time t=5 ms the electrode erosion leads to a copper plasma. This simple case shows the necessity to well consider the copper erosion in plasma modelling as in High Voltage Circuit Breaker (HVCB) where higher current are considered.