Open AccessA COMPACTING PROCESS OF THE EN AW 6060 ALLOY
Author(s) -
Lukáš Dragošek,
Róbert Kočiško,
Andrea Kováčová,
Róbert Bidulský,
Milan Škrobian
Publication year - 2015
Publication title -
acta polytechnica
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.207
H-Index - 15
eISSN - 1805-2363
pISSN - 1210-2709
DOI - 10.14311/ap.2015.55.0301
Subject(s) - scrap , extrusion , die (integrated circuit) , materials science , alloy , metallurgy , process (computing) , mechanical engineering , composite material , engineering , computer science , nanotechnology , operating system
This study reports on an investigation of factors affect the process of compacting Al chips which are used to direct scrap processing through the forward extrusion method. EN AW 6060 chips of different geometry and types were mainly used as the experimental material. The chips were compacted in a die with a vertical channel (10.3mm in diameter). To provide a range of processing conditions, three different weights were selected and compacting was performed under five, different compacting pressures. The movement of the chips within the die during compacting was analysed through numerical simulations using Deform 2D software. Study of the compacting process optimal parameters for increasing the density and enhancing the density distribution were defined. The results from our study clearly show that optimal conditions are obtained when the proportion of D/h is 1/1.1. Moreover, it was recognized that in the process of small chips compacting, there was obtained lower density than in the case of large chips.