Open AccessAtomic Diffusion Bonding : Room Temperature Bonding of Glass Substrates Using Metal, Oxide and Nitride Thin Films
Author(s) -
T. Shimatsu,
Miyuki Uomoto
Publication year - 2022
Publication title -
hyomen to shinku
Language(s) - English
Resource type - Journals
eISSN - 2433-5843
pISSN - 2433-5835
DOI - 10.1380/vss.65.454
Subject(s) - wafer , materials science , wafer bonding , anodic bonding , optoelectronics , thin film , nitride , oxide , sputtering , thermocompression bonding , composite material , layer (electronics) , nanotechnology , metallurgy