Open AccessHybrid Photonic Integrated Circuit Using Heterogeneous Material Bonding Technology
Author(s) -
Nobuhiko Nishiyama
Publication year - 2022
Publication title -
hyomen to shinku
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2433-5843
pISSN - 2433-5835
DOI - 10.1380/vss.65.264
Subject(s) - photonics , realization (probability) , photonic integrated circuit , transceiver , power consumption , fabrication , electronic engineering , computer science , materials science , power (physics) , electrical engineering , optoelectronics , engineering , cmos , physics , medicine , statistics , mathematics , alternative medicine , pathology , quantum mechanics